1. Cam optimization
Generally speaking, if we want to obtain high-quality multi-layer PCB proofing, we need to carry out corresponding cam processing in its production. When we do cam processing, we should first make appropriate compensation for its line width, and then ensure the optimization of spacing and pad. Therefore, only when the cam optimization is done well, can the circuit of multilayer circuit board get better signal, so as to ensure the quality of multilayer circuit board proofing.
2. Reasonable process
High quality multi-layer circuit board proofing should ensure that its process is reasonable. It can be judged by observing the regularity degree of the device. After reflow soldering and wave soldering, the device is very regular, and the tin coating is good, not to mention the phenomenon of continuous soldering
3. Neat appearance
After the multi-layer PCB proofing, first of all, observe whether the appearance is flat, whether there is burr on each corner, whether there is hole on PTH hole, and whether there is bubble or floating bubble and delamination between the base material of multi-layer PCB, wire surface and solder mask, and whether there is wave, wrinkle and grain on solder mask.
